Liquid Cooling Solutions

Driven by the rapid growth of artificial intelligence (AI), cloud services, and high-density computing (HPC) data centers, traditional air cooling systems are reaching their physical limits.

Rack power density has increased from the traditional 6kW to 100–200kW per rack for AI clusters, while air-cooled system is limited to 40–50kW per rack. To address the growing thermal challenges, liquid cooling has become the key solution for next-generation data centers, delivering significantly higher heat dissipation efficiency and enabling PUE levels as low as 1.05 to 1.1. This transition also helps reduce power consumption, improve chip reliability, and support sustainability goals for data centres.

Gerchamp provides a comprehensive liquid cooling portfolio including in-row/in-rack L2L coolant distribution units (CDU), L2A side car for NVIDIA GB300/Rubin NVL72, prefabricated liquid cooling containers (DLCC), immersion cooling solutions, and maintenance equipment for new data center, AI data center, and brownfield retrofit projects. Our solutions are aligned with the global shift toward high-density, energy-efficient, and rapidly deployable infrastructure, supporting current mainstream deployments, scalable expansion, and future ultra-high-density computing environments.